In this exhibition, Shenzhen Colibri Hi-Tech Co., Ltd. made a stunning appearance at booth 3G77 in Hall 3. Colibri Hi-Tech focuses on precision machining/Tooling/Die Sets and boasts over 500 precision machining equipment, striving to being an excellent enterprise in the high precision machining industry.

In the semiconductor precision machining field, Colibri Hi-Tech can provide customers with Chuck for wafer production stage testing (temperature-controlled suction cups, flatness 12μm), molds for wire frame, chip encapsulation, and rib cutting shaping in the sealing and testing stage, as well as fixtures, components, and modules for die bonding, chip testing, and LED packaging, such as Socket (probe module)/Carrier (accompanying fixture), with precision up to ±2μm for UVW alignment platform, IGBT (power semiconductor) top pin module, high-speed Z/R module, etc. It can meet the processing needs of various complex materials in the semiconductor industry, including various tungsten steel/engineering plastics/antistatic materials/graphite/optical glass/ceramics/synthetic stone/titanium/tantalum/molybdenum/indium/kovar alloy/invar alloy/Inconel nickel alloy/pyrolytic boron nitride/copper alloy series/magnesium alloy, etc.

In this exhibition, Colibri Technology showcased multiple semiconductor industry applications. Let’s take a look at some typical representatives together.

The UVW alignment platform is a mobile unit with XY direction and θ micro-rotation angle. Its applications are mainly focused on high-speed and high-precision industries such as wafer cutting and packaging inspection in the semiconductor industry, exposure machines in PCB manufacturing, screen printing machines, mobile phone manufacturing, and LCD/LED panel manufacturing.

The Chuck temperature-controlled suction cup is a wafer chuck that achieves precise temperature control during wafer testing. Its main purpose is to conduct wafer testing, laser trimming, and wafer aging in probe stations. The wafer thermal chuck has excellent electrical performance and is a highly reliable and high-precision Wafer Thermal Chuck, which can be integrated with manual, semi-automatic, or fully automatic probe stations.

The wafer edge finder utilizes visual algorithms to analyze the XYθ axis, thereby compensating for the eccentricity of the wafer and aligning notches to a preset direction, preparing it for the next process. It offers advantages such as high positioning accuracy and high-speed positioning, which can reduce wafer processing time and improve production efficiency.

The ARP-185 series robotic arm employs servo motor drive, enabling high-speed and high-precision positioning, suitable for applications in wafer testing equipment, EFEM (Equipment Front End Module), AOI (Automated Optical Inspection) equipment, and more.

Wire-Bond Clamps are fixtures on automatic wire bonding machines used in semiconductor packaging equipment, mainly comprised of a pressure plate and a base plate. The wire bonding machine is a high-precision electronic welding device, thus requiring high-quality fixtures.

Locking down booth 3G77, Colibri Technology cordially invites industry colleagues to visit and guide the booth, working together to achieve excellence in intelligent manufacturing.